Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability

(4.6/5) - 306 ratings
Authors: Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma (auth.)
Publisher: Springer US
Genre: Unknown
Pages: 253
Language: english
Year: 2015
ISBN 10: Unknown
ISBN 13: 978-1-4614-9266-5
Series: Unknown
Edition: 1
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Synopsis

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include...